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Nos liseuses Vivlio rencontrent actuellement des problèmes de synchronisation. Nous faisons tout notre possible pour résoudre ce problème le plus rapidement possible. Toutes nos excuses pour la gêne occasionnée !
- Retrait gratuit dans votre magasin Club
- 7.000.0000 titres dans notre catalogue
- Payer en toute sécurité
- Toujours un magasin près de chez vous
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Description
Application Example 1: Lateral Resolution of in-Lens SE and High-Angle BSE Imaging at Low Accelerating Voltages, Below 2.0 kV.- Application Example 2: Z-Contrast Sensitivity in Low-Voltage, High-Angle BSE Imaging.- Application Example 3: Information Depth in Low-Voltage, High-Angle BSE Imaging.- Application Example 4: Nano Inclusions in Co-Hardened Gold Plating for Electronic Applications #x2013; Further Evidence for High Lateral Resolution in Low-Voltage, High-Angle BSE Imaging.- Application Example 5: A Thin Layer of Organic Contaminant on the Surface of Mirror-Polished Al-Based Hard Disks.- Application Example 6: A Further Potential of Ultralow-Voltage In-lens SE Imaging.- Application Example 7: Sample Surface Preparation by Ultramicrotomy Using a Diamond Knife for Cross-Sectional Examination of Various Coatings on Metals.- Application Example 8: Cross-Sectional Examination of a Galvanized Steel.- Application Example 9: Cross-Sectional Examination of a Painted Steel.- Application Example 10: Cross-Sectional Examination of Solder Joint of the Printed Circuit Board.- Application Example 11: Cross-Sectional Examination of a Tin-Plated Copper Sheet for Electronic Application.- Application Example 12: Cross-Sectional Examination of an Anodized Aluminum Alloy for Aerospace Application.- Application Example 13: Cross-Sectional Examination of a Porous Anodic Oxide Film Grown on a Heterogeneous Al-Fe Alloy.- Application Example 14: Corrosion of an Al 2024-T3 Alloy for Aerospace Application.- Application Example 15: Cross-Sectional Examination of an Etched Al Foil for Capacitor Application.- Application Example 16: On the Nature of rf-GD Sputtering.- Application Example 17: On the Surface Damages Associated with rf-GD Sputtering.- Application Example 18: Precipitates in a Stainless Steel.- Application Example 19: Ferrite Precipitates in a Low-Carbon Stainless Steel.- Application Example 20: A Novel Use of rf-GD Sputtered Surfaces for Oxidation Study of Iron, Nickel, and Copper.- Application Example 21: Preparation of #x201C;Highly Flat and Damage-Free#x201D; Surfaces for High-Resolution Channeling BSE Imaging.- Application Example 22: Oxidation of Sputtered Metal Surface in Air #x2013; The Main Cause of Surface Alternation.- Application Example 23: Microstructure of a Ti Alloy.- Application Example 24: Microstructure of a Ni-Based Super Alloy for Aerospace Applications.- Application Example 25: Cracks in a Nitrogen-Doped Stainless Steel.- Application Example 26: Sample Surface Preparation Using rf-GD Sputtering for Cross-Sectional Examination.- Application Example 27: Cross-Sectional Examination of a Galvanized Steel for Car Bodies.- Application Example 28: Cross-Sectional Examination of a Flash Memory Device.- Application Example 29: Cross-Sectional Examination of a Multilayered Glass.- Application Example 30: Cross-Sectional Examination of a Copper Sheet for Electronic Application.- Application Example 31: Cross-Sectional Examination of a Nitrided Carbon Steel.- Application Example 32: Cross-Sectional Examination of Deformed Surface Regions of Carbon Steel after Shot Peening.- Application Example 33: Cross-Sectional Examination of a Thermal-Sprayed WC-18% Co Coating on a Titanium Alloy.- Application Example 34: Cross-Sectional Examination of a Thermal Barrier Coating on the Ni-based Super Alloy for Aerospace Applications.- Application Example 35: Is EDX Elemental Mapping Really Necessary?.- Application Example 36: Titanium Carbide Precipitates in a Duplex Stainless Steel.- Application Example 37: Adhesion Between the Hard Chromium Coating and Copper Substrate.- Application Example 38: On the Possibility of the Use of rf-GD Sputtering for Follow-Up Treatment of Thin Slices for TEM Examination.- Application Example 39: On 3D Imaging of Semiconductor Devices by FE-SEM.- Concluding Remarks.
Spécifications
Parties prenantes
- Auteur(s) :
- Editeur:
Contenu
- Nombre de pages :
- 182
- Langue:
- Anglais
- Collection :
- Tome:
- n° 45
Caractéristiques
- EAN:
- 9783642261688
- Date de parution :
- 04-05-12
- Format:
- Livre broché
- Format numérique:
- Trade paperback (VS)
- Dimensions :
- 155 mm x 229 mm
- Poids :
- 294 g
