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- Retrait gratuit dans votre magasin Club
- 7.000.000 titres dans notre catalogue
- Payer en toute sécurité
- Toujours un magasin près de chez vous
Assembly and Reliability of Lead-Free Solder Joints
John H Lau, Ning-Cheng Lee
Livre relié | Anglais
231,45 €
+ 462 points
Format
Description
This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.
Spécifications
Parties prenantes
- Auteur(s) :
- Editeur:
Contenu
- Nombre de pages :
- 527
- Langue:
- Anglais
Caractéristiques
- EAN:
- 9789811539190
- Date de parution :
- 30-05-20
- Format:
- Livre relié
- Format numérique:
- Genaaid
- Dimensions :
- 196 mm x 239 mm
- Poids :
- 907 g
