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Description
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Proven 2D and 3D IC lead-free interconnect reliability techniques
Proven 2D and 3D IC lead-free interconnect reliability techniques
Reliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing services (EMS) on second-level interconnects, packaging assembly on first-level interconnects, and 3D IC integration on microbumps and through-silicon-via (TSV) interposers. Design reliable 2D and 3D IC interconnects in RoHS-compliant projects using the detailed information in this practical resource.
Covers reliability of:
- 2D and 3D IC lead-free interconnects
- CCGA, PBGA, WLP, PQFP, flip-chip, lead-free SAC solder joints
- Lead-free (SACX) solder joints
- Low-temperature lead-free (SnBiAg) solder joints
- Solder joints with voids, high strain rate, and high ramp rate
- VCSEL and LED lead-free interconnects
- 3D LED and 3D MEMS with TSVs
- Chip-to-wafer (C2W) bonding and lead-free interconnects
- Wafer-to-wafer (W2W) bonding and lead-free interconnects
- 3D IC chip stacking with low-temperature bonding
- TSV interposers and lead-free interconnects
- Electromigration of lead-free microbumps for 3D IC integration
Spécifications
Parties prenantes
- Auteur(s) :
- Editeur:
Contenu
- Nombre de pages :
- 640
- Langue:
- Anglais
- Collection :
Caractéristiques
- EAN:
- 9780071753791
- Date de parution :
- 22-12-10
- Format:
- Livre relié
- Format numérique:
- Genaaid
- Dimensions :
- 157 mm x 231 mm
- Poids :
- 907 g
